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BIWIN
®
SSD
Elite Series
Pro Series
Smart Series
Industrial Series
OEM/ODM Solution
USB Flash Drive
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Wafer Packaging Solution
Lead Frame Based
TSOP48
QFN
QFP
Substrate Based
BGA
LGA
UDP
micro UDP
Embedded Product
qSSD
e-MMC
qSD
cNAND
TSOP48
Dimension: 12.0X20.0X1.2mmH
Specification
TSOP 48 is a package which has 48 leads, 12.0 X 20. 0X 1.2 mm. It can be mounted into U disk or other PCB to achieve storage function
Packing Detail